PRODUCTS CENTER

Panel level packaging

≤±7mm

515*510mm，Square panels in various sizes

Uniformity： WiW≤3% WtW≤5% CPK=1.67

PI film developing
PR film developing
Copper etching
Titanium etching

1-4 chambers（Supporting customization）
2-4 FOUP（Supporting customization）
Chemicals(Ex):Cyclopentanone，PGMEA，TMAH，NaCO3，DICO2，Ti Etching solution，Cu Etching solution，H2SO4 and other back spray configurations are available for selection
Supporting chemical CCSS，LCSS
Heating control, concentration control, flow rate control, pressure control et al.
Separated exhaust for acid, base and organics
Chemical reclaim
Bath overheating protection，leakage detection, classified discharge
SECS/GEM communication