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Focus on investment and development layout of semiconductor wet process equipment industry

Fully realize the domestic substitution of semiconductor wet process equipment

SINGLE WAFER CLEANER(SC SERIES)

Process Coverage

RCA cleaning, pre-deposition cleaning, post-etch cleaning, post-CMP cleaning,wet etch, pre-EPI cleaning et al.

Wafer size

150~300mm

Process Specification

Uniformity: WiW≤3%；WtW≤3%；RtR≤3%
Particle adders: PA<20ea@0.09um （SiO2 wafer with incoming particle count <50ea）
Metal contamination: <5E9 atoms/cm2

Features & configurations

2~4 chambers, supporting customization
2~4 MIF/FOUP
Supporting chemistry C.C.S.S. and L.C.S.S.
Heating control, concentration control, flow rate control, pressure control et al.
Separated exhaust for acid, base and organics
Chemistry reclaim
High-definition camera, Anti-static (option)
SECS/GEM communication

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