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Focus on investment and development layout of semiconductor wet process equipment industry

Fully realize the domestic substitution of semiconductor wet process equipment

CU-TI ETCHING（SC SERIES）

Applications

Advanced packaging

Wafer Size

200mm~300mm

Process Specification

Uniformity：WIW≤5%
Recovery of liquid medicine≥95%

Features&configurations

2~4 chambers（Supporting customization）
2 Smif/FOUP
Chemicals(Ex):Cu Etch solution，Titanium etchant.
Supporting chemistry CCSS，LCSS
Heating control,concentration control,flow rate control,pressurecontrol et al.
Separated exhaust for acid, base and organics
Chemistry reclaim
Bath overheating protection，leakage detection, classified discharge
SECS/GEM communication

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