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Focus on investment and development layout of semiconductor wet process equipment industry
Fully realize the domestic substitution of semiconductor wet process equipment

SINGLE WAFER CLEANER（SC3100 SERIES）

Applications
RCA cleaning,GATE cleaning,oxide etching and removal,photoresist stripping
Wafer size
300mm
Process Specification
Etch Rate Uniformity(%) : < 3%
Particle adders:<10ea @19nm, Bare Si
Metal contamination(ICPMS) : < 1E8 atm/cm2
Application of Wet Cleaning Processes
Particle removal
Metal contamination removal
Organic contamination removal
Photoresist stripping
Pre-cleaning and Post-cleaning
Oxide etching and removal
Al interconnect cleaning
Cu interconnect cleaning
Features&configurations
● WPH:300
● 8 chambers
● 4 FOUP
● Chemicals(Ex):DHF,SC1,SC2,DIO3,DICO2,IPA
● Backside Protection:Option,3ea nozzles
● Heating control,concentration control,flow rate control,pressure control et al.
● SECS/GEM communication
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苏州智程半导体科技股份有限公司
SUZHOU ZHICHENG SEMICONDUCTOR TECHNOLOGY CO., LTD. 
Tel:0512-57762325 0512-55239392
Add:889 Zhonghua Road, Kunshan City, Jiangsu Province
Email:zse@zc-semi.com
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