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Focus on investment and development layout of semiconductor wet process equipment industry
Fully realize the domestic substitution of semiconductor wet process equipment

WAFER BACKSIDE ETCHING EQUIPMENT（SC SERIES）

Applications
Application of silicon carbide and silicon power devices,silicon-based process devices
Wafer Size
150~300mm
Application of Wet Cleaning Processes
Back side thinning process
Backside cleaning
Sheet cleaning
Process Specification
Uniformity：
WiW≤5%
Particle adders：PA＜20ea@0.09μm
Features&configurations
2~4 chambers（Supporting customization）
2~4 Open Cassette/Smif/FOUP
Chemicals(Ex):Etchant，SC1，SC2，DHF，DIO3， DICO2，IPA
Supporting chemistry CCSS，LCSS
Heating control, concentration control, flow ratecontrol, pressure control et al.
Separated exhaust for acid, base and organics
Chemistry reclaim
Bath overheating protection，leakage detection, classified discharge
SECS/GEM communication
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苏州智程半导体科技股份有限公司
SUZHOU ZHICHENG SEMICONDUCTOR TECHNOLOGY CO., LTD. 
Tel:0512-57762325 0512-55239392
Add:889 Zhonghua Road, Kunshan City, Jiangsu Province
Email:zse@zc-semi.com
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