PRODUCTS CENTER

Focus on investment and development layout of semiconductor wet process equipment industry
Fully realize the domestic substitution of semiconductor wet process equipment

BACK CLEARER(SC SERIES)

Applications
Advanced packaging
Wafer Size
150mm~300mm
Warpage
≤±6mm
Application of Wet Cleaning Processes
Backside cleaning after thinning in advanced packaging
Features&configurations
WPH:55~60
4 chambers
2FOUP
Chemicals(Ex):DICO2
Bath overheating protection,leakage detection, Separate drainage
SECS/GEM communication
苏州智程半导体科技股份有限公司
SUZHOU ZHICHENG SEMICONDUCTOR TECHNOLOGY CO., LTD. 
Tel:0512-57762325 0512-55239392
Add:889 Zhonghua Road, Kunshan City, Jiangsu Province
Email:zse@zc-semi.com
设计开发:联合企邦
0512-57762325
0512-55239392
zse@zc-semi.com