Home
Product
Application
Product Type
News
Dynamic
Information
Supplier
Order Terms and Conditions
Supplier solicitation
Service
About
Introduction
History
Culture
Honor
Contact
Contact
Join Us
Message
en
cn
en
Home
Product
Application
Product Type
News
Dynamic
Information
Supplier
Order Terms and Conditions
Supplier solicitation
Service
About
Introduction
History
Culture
Honor
Contact
Contact
Join Us
Message
PRODUCTS CENTER
Home
/
Product
Focus on investment and development layout of semiconductor wet process equipment industry
Fully realize the domestic substitution of semiconductor wet process equipment
BACK CLEARER(SC SERIES)
Applications
Advanced packaging
Wafer Size
150mm~300mm
Warpage
≤±6mm
Application of Wet Cleaning Processes
Backside cleaning after thinning in advanced packaging
Features&configurations
WPH:55~60
4 chambers
2FOUP
Chemicals(Ex):DICO2
Bath overheating protection,leakage detection, Separate drainage
SECS/GEM communication
PRODUCTS
MORE
Advanced Packaging
Compound Semiconductor
SPIN COMPOSITE MACHINE
(SC SERIES)
SINGLE WAFER CLEANER(SC SERIES)
SINGLE WAFER CLEANER(SC3100 SERIES)
SPIN SCRUBBER(SS SERIES)
WAFER BACKSIDE ETCHING EQUIPMENT(SC SERIES)
CU-TI ETCHING(SC SERIES)
0512-57762325
0512-55239392
zse@zc-semi.com