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Focus on investment and development layout of semiconductor wet process equipment industry
Fully realize the domestic substitution of semiconductor wet process equipment

SPIN SCRUBBER（SS SERIES）

Applications
Wafer fabrication（Si and Sic）and advanced packaging
Wafer size
150~300mm
Process specifications
PA ≤20ea@0.09μm
PRE ≥97%@0.09μm
metal contamination ≤5E9 atoms/cm2
Features & configurations
2~4 load ports
4~8 cleaning chambers
Wafer flip function, front size and back side cleaning in sequence
Configured with back side and edge scrubber
N2 atomizing two-fluid cleaning
苏州智程半导体科技股份有限公司
SUZHOU ZHICHENG SEMICONDUCTOR TECHNOLOGY CO., LTD. 
Tel:0512-57762325 0512-55239392
Add:889 Zhonghua Road, Kunshan City, Jiangsu Province
Email:zse@zc-semi.com
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设计开发：联合企邦
0512-57762325
0512-55239392
zse@zc-semi.com