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Focus on investment and development layout of semiconductor wet process equipment industry
Fully realize the domestic substitution of semiconductor wet process equipment
ZSE AUTO BENCH(BC SERIES)
Application
Wafer level packaging in the PR Stripping, atmospheric pressure flux cleaning, metal etching and other applications
Wafer size
200~300mm
Support warping operation
Can be compatible with warping degree ±5MM
Application of Wet Cleaning Processes
PR Stripping Atmospheric flux cleaning, metal etching
Features&configurations
● WPH≥70
● 2 FOUP
● Heating control,concentration control,flow rate control,pressure control et al.
● Bath overheating protection,leakage detection, classified discharge
● SECS/GEM communication
PRODUCTS
MORE
Integrated circuit manufacturing
Advanced packaging
Semiconductor substrates
Compound semiconductors
ZSE AUTO BENCH(BC SERIES)
WET BENCH( BC SERIES)
WET BENCH(BC3100 SERIES)
0512-57762325
0512-55239392
zse@zc-semi.com