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Focus on investment and development layout of semiconductor wet process equipment industry
Fully realize the domestic substitution of semiconductor wet process equipment

WET BENCH（BC3100 SERIES）

Process Coverage
RCA clean ,GATE clean ,Oxide etch ,PR strip
Tool type
Cassetteless type
Wafer size
300mm
Process Specification
Etch Rate Uniformity(%) : <3%
Particle adders:Particle：<30ea@ 60nm, Bare Si
Metal contamination(ICPMS) : <1E9 atm/cm2
Large silicon wafer applications
Alkali etching equipment,cleaning equipment after polishing,Pre-cleaning equipment,and finally cleaning equipment
Features & configurations
● Capacity (Wafer Pitch) : 50Wafers (25Wafers/FOUP*2)/5mm Half Pitch
● Supporting C.C.S.S,L.C.S.S
● Marangoni dry,LPD dry
● Auto dosing,bleed&feed
● Heating control,concentration control,flow rate control,pressure control et al.
● Bath overheating protection，leakage detection, Separate drainage
● SECS/GEM communication
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苏州智程半导体科技股份有限公司
SUZHOU ZHICHENG SEMICONDUCTOR TECHNOLOGY CO., LTD. 
Tel:0512-57762325 0512-55239392
Add:889 Zhonghua Road, Kunshan City, Jiangsu Province
Email:zse@zc-semi.com
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0512-57762325
0512-55239392
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