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Focus on investment and development layout of semiconductor wet process equipment industry

Fully realize the domestic substitution of semiconductor wet process equipment

WET BENCH( BC SERIES)

Process Coverage

RCA cleaning, PR wet strip, Dielectric layer wet etch, Metal layer wet etch et al.

Applications

Sic、GaN-on-Si

Tool type

Cassette-type & Cassetteless-type

Wafer size

150mm~300mm

Process Specification

Uniformity : WiW ≤4; WtW≤4%；RtR≤4%
Particle adders: PA<30ea@0.09um（SiO2 wafer with incoming particle count <50ea）
Metal contamination: <5E9 atoms/cm2

Features & configurations

Supporting C.C.S.S and L.C.S.S.
Marangoni dry or spin dry
Auto dosing, bleed&feed
Heating control, concentration control,flow rate control, pressure control et al.
Bath overheating protection, leak sensors configuration
Chemistry reclaim
SECS/GEM communication

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