Recently, Zhicheng Semiconductor VMAX electroplating equipment has been successfully delivered to important domestic customers. The equipment is independently developed and manufactured by Zhicheng Semiconductor, and is the company's main model in the field of advanced packaging electroplating.

About VMAX type electroplating equipment

VMAX type electroplating equipment is mainly for the plating process required by Pillar, Bump, RDL, TSV and so on in advanced packaging，Compatible with 8/12 inches，Up to 3 LADports, 24 plating chambers, 4 pre-wetting chambers and 4 cleaning chambers can be configured。The equipment adopts unique sealing technology, anode and cathode separation technology, etc., with excellent bath stability, no cross contamination.It also supports modular maintenance to effectively improve product uptime.

VMAX type electroplating equipment is one of the few domestic wafer-level electroplating mass production models, providing domestic advanced packaging customers with domestic wafer plating solutions.In the future, Wisdom Semiconductor will continue to launch advanced wet process equipment in the field of integrated circuit manufacturing, and continue to promote the localization process of advanced manufacturing of optical conductors.