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Focus on investment and development layout of semiconductor wet process equipment industry
Fully realize the domestic substitution of semiconductor wet process equipment

METAL LIFT-OFF EQUIPMENT (CC SERIES)

Applications
Lift off process for power devices, filters, MEMS, LED and other fields
Wafer size
150~300mm
Process Specification
PR & metal residue free
Features & configurations
Standard configuration: 3 chambers (soaking, stripping, cleaning)
Support multiple process cavities
Maximum speed: 3000 RPM, speed accuracy: ±1RPM
NMP heating temperature Room temperature ~90℃±2℃
The maximum pressure of high-pressure degumming 18MPa
The process liquid can be recycled and filtered for use
Equipped with ultrasonic degumming function
Equipped with CO2 automatic fire extinguishing system
苏州智程半导体科技股份有限公司
SUZHOU ZHICHENG SEMICONDUCTOR TECHNOLOGY CO., LTD. 
Tel:0512-57762325 0512-55239392
Add:889 Zhonghua Road, Kunshan City, Jiangsu Province
Email:zse@zc-semi.com
设计开发:联合企邦
0512-57762325
0512-55239392
zse@zc-semi.com