Focus on investment and development layout of semiconductor wet process equipment industry
Fully realize the domestic substitution of semiconductor wet process equipment
METAL LIFT-OFF EQUIPMENT (CC SERIES)
Applications
Lift off process for power devices, filters, MEMS, LED and other fields
Wafer size
150~300mm
Process Specification
PR & metal residue free
Features & configurations
Standard configuration: 3 chambers (soaking, stripping, cleaning)
Support multiple process cavities
Maximum speed: 3000 RPM, speed accuracy: ±1RPM
NMP heating temperature Room temperature ~90℃±2℃
The maximum pressure of high-pressure degumming 18MPa
The process liquid can be recycled and filtered for use
Equipped with ultrasonic degumming function
Equipped with CO2 automatic fire extinguishing system