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Focus on investment and development layout of semiconductor wet process equipment industry

Fully realize the domestic substitution of semiconductor wet process equipment

ZSE VMAX 3D ECD SYSTEM

Applications

Pillar, Bump, RDL, TSV et al.

Wafer size

150~300mm

Process specifications

Uniformity: WiW ≤ 5%, WtW ≤5%, RtR ≤3%

Features & configurations

Maximum of 3 load ports
Maximum of 24 plating chambers: Cu, Ni, Sn/Ag, Au
Maximum of 4 prewet chambers, 4 SRD chambers
Fountain type plating cell design, no cross contamination risk
Module PM design, high tool uptime
Seal technology, good seal performance
Catholyte/anolyte separation technology, good solution stability

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